Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel

ABSTRACT

A display apparatus includes a display panel and a display panel driver. The display panel includes a first substrate and a second substrate facing the first substrate, wherein the first substrate includes a switching element, a data line and a gate line, wherein the data line and the gate line are electrically connected to the switching element. The display panel driver includes a data driving chip and a gate driving chip, wherein the data driving chip applies a data signal to the data line and the gate driving chip applies a gate signal to the gate line, wherein the gate driving chip is disposed on a surface of the data driving chip.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2015-0120962, filed on Aug. 27, 2015, in the KoreanIntellectual Property Office (KIPO), the disclosure of which isincorporated by reference herein in its entirety.

TECHNICAL FIELD

Exemplary embodiments of the present invention relate to a displayapparatus. More particularly, exemplary embodiments of the presentinvention relate to a display apparatus including a driver applying adriving signal.

DISCUSSION OF THE RELATED ART

Generally, a display apparatus includes a display panel and a displaypanel driver. A driving chip of the display panel driver may be mountedas a chip on glass (COG) on a peripheral region of the display panel. Inaddition, the driving chip of the display panel driver may be mounted ona flexible film connected to the peripheral region of the display panelas a chip on film (COF).

The driving chip may include a plurality of data driving chips disposedon a long side of the display panel and a plurality of gate drivingchips disposed on a short side of the display panel.

Accordingly, a size of a bezel of the display panel may be large and theinstallation of the gate and data driving chips may be time consuming.

SUMMARY

According to an exemplary embodiment of the present invention, a displayapparatus includes a display panel and a display panel driver. Thedisplay panel includes a first substrate and a second substrate facingthe first substrate, wherein the first substrate includes a switchingelement, a data line and a gate line, wherein the data line and the gateline are electrically connected to the switching element. The displaypanel driver includes a data driving chip and a gate driving chip,wherein the data driving chip applies a data signal to the data line andthe gate driving chip applies a gate signal to the gate line, whereinthe gate driving chip is disposed on a surface of the data driving chip.

In an exemplary embodiment of the present invention, the display paneldriver further includes a printed circuit board including a drivingcircuit and a flexible substrate including a plurality of bonding pads,wherein the flexible substrate electrically connects the printed circuitboard with the display panel. The data driving chip is disposed on theflexible substrate.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body and a first pad disposed on a topsurface of the data driving chip body. The display panel driver furtherincludes a first bonding wire electrically connecting the first pad witha first bonding pad of the plurality of bonding pads of the flexiblesubstrate.

In an exemplary embodiment of the present invention, the gate drivingchip includes a gate driving chip body and a second pad disposed on atop surface of the gate driving chip body. The display panel driverfurther includes a second bonding wire electrically connecting thesecond pad with a second bonding pad of the plurality of bonding pads ofthe flexible substrate.

In an exemplary embodiment of the present invention, the data drivingchip further includes a third pad disposed on the top surface of thedata driving chip body, wherein the second bonding wire electricallyconnects the second pad and the third pad with the second bonding pad ofthe plurality of bonding pads of the flexible substrate.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body and a third pad disposed on abottom surface of the data driving chip body. The display panel driverfurther includes a first conductive adhesive layer disposed between thedata driving chip and the flexible substrate. The first conductiveadhesive layer electrically connects the third pad with a first bondingpad of the plurality of bonding pads of the flexible substrate.

In an exemplary embodiment of the present invention, the gate drivingchip includes a gate driving chip body and a second pad disposed on atop surface of the gate driving chip body. The display panel driverfurther includes a second bonding wire electrically connecting thesecond pad with a second bonding pad of the plurality of bonding pads ofthe flexible substrate.

In an exemplary embodiment of the present invention, the data drivingchip further includes a first pad disposed on a top surface of the datadriving chip body. The second bonding wire electrically connects thefirst pad and the second pad with the second bonding pad of theplurality of bonding pads of the flexible substrate.

In an exemplary embodiment of the present invention, the gate drivingchip includes a gate driving chip body and a fourth pad disposed on abottom surface of the gate driving chip body. The data driving chipfurther includes a first pad disposed on a top surface of the datadriving chip body. The display panel driver further includes a secondconductive adhesive layer disposed between the gate driving chip and thedata driving chip. The second conductive adhesive layer electricallyconnects the fourth pad with the first pad.

In an exemplary embodiment of the present invention, the data drivingchip is disposed on the first substrate, wherein the first substrateincludes a plurality of bonding pads, wherein the data driving chip iselectrically connected to the first substrate through the plurality ofbonding pads.

In an exemplary embodiment of the present invention, the data drivingchip further includes a data driving chip body and a first pad disposedon a top surface of the data driving chip body. The display panel driverfurther includes a first bonding wire electrically connecting the firstpad with a first bonding pad of the plurality of bonding pads of thefirst substrate.

In an exemplary embodiment of the present invention, the gate drivingchip further includes a gate driving chip body and a second pad disposedon a top surface of the gate driving chip body. The display panel driverfurther includes a second bonding wire electrically connecting thesecond pad with a second bonding pad of the plurality of bonding pads ofthe first substrate.

In an exemplary embodiment of the present invention, wherein the datadriving chip further includes a third pad disposed on the top surface ofthe data driving chip body, wherein the second bonding wire electricallyconnects the second pad and the third pad with the second bonding pad ofthe plurality of bonding pads of the first substrate.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body and a third pad disposed on abottom surface of the data driving chip body. The display panel driverfurther includes a first conductive adhesive layer disposed between thedata driving chip and the first substrate. The first conductive adhesivelayer electrically connects the third pad with a first bonding pad ofthe plurality of bonding pads of the first substrate.

In an exemplary embodiment of the present invention, the gate drivingchip includes a gate driving chip body and a second pad disposed on atop surface of the gate driving chip body. The display panel driverfurther includes a second bonding wire electrically connecting thesecond pad with a second bonding pad of the plurality of bonding pads ofthe first substrate.

In an exemplary embodiment of the present invention, the data drivingchip further includes a first pad disposed on a top surface of the datadriving chip body. The second bonding wire electrically connects thefirst pad and the second pad with the second bonding pad of theplurality of bonding pads of the first substrate.

In an exemplary embodiment of the present invention, the gate drivingchip includes a gate driving chip body and a fourth pad disposed on abottom surface of the gate driving chip body. The data driving chipfurther includes a first pad disposed on a top surface of the datadriving chip body. The display panel driver further includes a secondconductive adhesive layer disposed between the gate driving chip and thedata driving chip. The second conductive adhesive layer electricallyconnects the fourth pad with the first pad.

In an exemplary embodiment of the present invention, a size of the gatedriving chip is substantially the same as a size of the data drivingchip in plan view.

In an exemplary embodiment of the present invention, a size of the gatedriving chip is less than a size of the data driving chip in plan view.

In an exemplary embodiment of the present invention, the display paneldriver further includes a sealing member covering the data driving chipand the gate driving chip.

According to an exemplary embodiment of the present invention, a displayapparatus includes a display panel and a display panel driver. Thedisplay panel includes first and second substrates facing each other,wherein the first substrate includes a switching element, a data lineand a gate line, wherein the data line and the gate line areelectrically connected to the switching element. The display paneldriver includes a data driving chip and a gate driving chip, wherein thedata driving chip applies a data signal to the data line and the gatedriving chip applies a gate signal to the gate line, wherein the gatedriving chip overlaps the data driving chip.

In an exemplary embodiment of the present invention, the data drivingchip and the gate driving chip are disposed on the first substrate,wherein the data driving chip is electrically connected to the data linethrough a first bonding pad disposed on the first substrate and the gatedriving chip is electrically connected to the gate line through a secondbonding pad disposed on the first substrate.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a first pad isdisposed on a top surface of the data driving chip body and the firstpad is adjacent to a first side of the data driving chip body, whereinthe first side of the data driving chip body corresponds to the firstside of the gate driving chip body. The first and second bonding padsare disposed on a region of the first substrate that is adjacent to thefirst side of the data driving chip body. A first bonding wireelectrically connects the first pad with the first bonding pad, and asecond bonding wire electrically connects the second pad with the secondbonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a first pad isdisposed on a top surface of the data driving chip body and the firstpad is adjacent to a first side of the data driving chip body, wherein athird pad is disposed on the top surface of the data driving chip bodyand the third pad is adjacent to the first pad, wherein the first sideof the data driving chip body corresponds to the first side of the gatedriving chip body. The first and second bonding pads are disposed on aregion of the first substrate that is adjacent to the first side of thedata driving chip body. A first bonding wire electrically connects thefirst pad with the first bonding pad, and a second bonding wireelectrically connects the second pad and the third pad with the secondbonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a third pad isdisposed on a bottom surface of the data driving chip body and the thirdpad is adjacent to a first side of the data driving chip body, whereinthe first side of the data driving chip body corresponds to the firstside of the gate driving chip body. The third pad is disposed on thefirst bonding pad, and a first conductive adhesive layer is disposedbetween the third pad and the first bonding pad to electrically connectthe third pad with the first bonding pad. The second bonding pad isdisposed on a region of the first substrate that is adjacent to thefirst side of the data driving chip body. A second bonding wireelectrically connects the second pad with the second bonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a third pad isdisposed on a bottom surface of the data driving chip body and the thirdpad is adjacent to a first side of the data driving chip body, wherein afirst pad is disposed on a top surface of the data driving chip body andthe first pad is adjacent to the first side of the data driving chipbody, wherein the first side of the data driving chip body correspondsto the first side of the gate driving chip body. The third pad isdisposed on the first bonding pad, and a first conductive adhesive layeris disposed between the third pad and the first bonding pad toelectrically connect the third pad with the first bonding pad. Thesecond bonding pad is disposed on a region of the first substrate thatis adjacent to the first side of the data driving chip body. A secondbonding wire electrically connects the second pad and the first pad withthe second bonding pad.

In an exemplary embodiment of the present invention, the first substrateincludes a first side and a second side, wherein the first side islonger than the second side. The data driving chip is disposed on thefirst side of the first substrate.

According to an exemplary embodiment of the present invention, a displayapparatus includes a display panel and a display panel driver. Thedisplay panel includes first and second substrates facing each other,wherein the first substrate includes a switching element, a data lineand a gate line, wherein the data line and the gate line areelectrically connected to the switching element. The display paneldriver includes a data driving chip, a gate driving chip, a printedcircuit board including a driving circuit, and a flexible substrateincluding a first bonding pad and a second bonding pad. The data drivingchip and the gate driving chip are disposed on the flexible substrate,and the flexible substrate electrically connects the printed circuitboard with the display panel through the first and second bonding pads.The gate driving chip overlaps the data driving chip.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a first pad isdisposed on a top surface of the data driving chip body and the firstpad is adjacent to a first side of the data driving chip body, whereinthe first side of the data driving chip body corresponds to the firstside of the gate driving chip body. The first and second bonding padsare disposed on a region of the flexible substrate that is adjacent tothe first side of the data driving chip body. A first bonding wireelectrically connects the first pad with the first bonding pad, and asecond bonding wire electrically connects the second pad with the secondbonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a first pad isdisposed on a top surface of the data driving chip body and the firstpad is adjacent to a first side of the data driving chip body, wherein athird pad is disposed on the top surface of the data driving chip bodyand the third pad is adjacent to the first pad, wherein the first sideof the data driving chip body corresponds to the first side of the gatedriving chip body. The first and second bonding pads are disposed on aregion of the flexible substrate that is adjacent to the first side ofthe data driving chip body. A first bonding wire electrically connectsthe first pad with the first bonding pad, and a second bonding wireelectrically connects the second pad and the third pad with the secondbonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a third pad isdisposed on a bottom surface of the data driving chip body and the thirdpad is adjacent to a first side of the data driving chip body, whereinthe first side of the data driving chip body corresponds to the firstside of the gate driving chip body. The third pad is disposed on thefirst bonding pad, and a first conductive adhesive layer is disposedbetween the third pad and the first bonding pad to electrically connectthe third pad with the first bonding pad. The second bonding pad isdisposed on a region of the flexible substrate that is adjacent to thefirst side of the data driving chip body. A second bonding wireelectrically connects the second pad with the second bonding pad.

In an exemplary embodiment of the present invention, the data drivingchip includes a data driving chip body, and the gate driving chipincludes a gate driving chip body. A second pad is disposed on a topsurface of the gate driving chip body and the second pad is adjacent toa first side of the gate driving chip body, wherein a third pad isdisposed on a bottom surface of the data driving chip body and the thirdpad is adjacent to a first side of the data driving chip body, wherein afirst pad is disposed on a top surface of the data driving chip body andthe first pad is adjacent to the first side of the data driving chipbody, wherein the first side of the data driving chip body correspondsto the first side of the gate driving chip body. The third pad isdisposed on the first bonding pad, and a first conductive adhesive layeris disposed between the third pad and the first bonding pad toelectrically connect the third pad with the first bonding pad. Thesecond bonding pad is disposed on a region of the flexible substratethat is adjacent to the first side of the data driving chip body. Asecond bonding wire electrically connects the second pad and the firstpad with the second bonding pad.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become moreapparent by describing in detail exemplary embodiments thereof inconjunction with the accompanying drawings, in which:

FIG. 1 is a plan view illustrating a display apparatus according to anexemplary embodiment of the present invention;

FIG. 2 is a perspective view illustrating the display apparatus of FIG.1, according to an exemplary embodiment of the present invention;

FIG. 3 is an enlarged view of region A of FIG. 1, according to anexemplary embodiment of the present invention;

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 1,according to an exemplary embodiment of the present invention;

FIG. 5 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 6 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 7 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 8 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 9 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 10 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 11 is a plan view illustrating a display apparatus, according to anexemplary embodiment of the present invention;

FIG. 12 is a perspective view illustrating the display apparatus of FIG.11, according to an exemplary embodiment of the present invention;

FIG. 13 is a cross-sectional view taken along line II-II′ of FIG. 11,according to an exemplary embodiment of the present invention;

FIG. 14 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 15 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 16 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention;

FIG. 17 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention; and

FIG. 18 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present invention will now be describedmore fully with reference to the accompanying drawings. The presentinvention may, however, be embodied in many different forms and shouldnot be construed as limited to the exemplary embodiments set forthherein. Like reference numerals may refer to like elements throughoutthis application.

FIG. 1 is a plan view illustrating a display apparatus according to anexemplary embodiment of the present invention. FIG. 2 is a perspectiveview illustrating the display apparatus of FIG. 1, according to anexemplary embodiment of the present invention. FIG. 3 is an enlargedview of region A of FIG. 1, according to an exemplary embodiment of thepresent invention. FIG. 4 is a cross-sectional view taken along lineI-I′ of FIG. 1, according to an exemplary embodiment of the presentinvention.

Referring to FIGS. 1 to 4, a display apparatus includes a display panel100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

For example, the first substrate 110 may be an array substrate. The gatelines GL and the data lines DL may be disposed on the first substrate110. A plurality of switching elements TR connected to the gate lines GLand the data lines DL may be disposed on the first substrate 110. Apixel electrode PE may be disposed on the first substrate 110.

The second substrate 120 may be a corresponding substrate opposite tothe first substrate 110. A common electrode facing the pixel electrodePE may be disposed under the second substrate 120. A color filterdefining a color of the pixel may be disposed under the second substrate120. Alternatively, the common electrode may be disposed on the firstsubstrate 110. The color filter may be disposed on the first substrate110.

An overlap area between the first substrate 110 and the second substrate120 may be substantially the same as the active region AA of the displaypanel 100. Alternatively, the overlap area between the first substrate110 and the second substrate 120, except for the area where a sealingmember is disposed, may be defined to the active region AA of thedisplay panel 100. As an example, the active region AA is an area wherethe first and second substrates 110 and 120 overlap, excluding a sealingmember that seals the first and second substrates 110 and 120.

The display apparatus may further include a display unit 130 interposedbetween the first and second substrates 110 and 120. The display unit130 may include an organic light emitting layer. Alternatively thedisplay unit 130 may include a liquid crystal layer.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 220. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 242 and 244. The plurality of bonding pads 242and 244 may be disposed on a top surface of the flexible substrate 240.The flexible substrate 240 may electrically connect the printed circuitboard 230 and the display panel 100.

For example, the printed circuit board 200 may include a driving circuitsuch as a timing controller, a power voltage generator, etc. Inaddition, the flexible substrate 240 may include polyimide.

The timing controller receives input image data and an input controlsignal from an external apparatus. The input image data may include redimage data, green image data and blue image data. The input controlsignal may include a master clock signal and a data enable signal. Theinput control signal may further include a vertical synchronizing signaland a horizontal synchronizing signal.

The timing controller generates a first control signal, a second controlsignal and a data signal based on the input image data and the inputcontrol signal.

The timing controller generates the first control signal for controllingan operation of the gate driving chip 220 based on the input controlsignal, and outputs the first control signal to the gate driving chip220.

The timing controller generates the second control signal forcontrolling an operation of the data driving chip 210 based on the inputcontrol signal, and outputs the second control signal to the datadriving chip 210.

The timing controller generates a data signal based on the input imagedata. The timing controller outputs the data signal to the data drivingchip 210.

The gate driving chip 220 generates gate signals driving the gate linesGL in response to the first control signal received from the timingcontroller. The gate driving chip 220 sequentially outputs the gatesignals to the gate lines GL.

The data driving chip 210 receives the second control signal and thedata signal from the timing controller. The data driving chip 210converts the data signal into analog data voltages. The data drivingchip 210 outputs the analog data voltages to the data lines DL.

The data driving chip 210 may be mounted on the flexible substrate 240as a chip on film (COF). For example, the data driving chip 210 may beadhered to the flexible substrate 240 by an adhesive layer 270interposed between the data driving chip 210 and the flexible substrate240.

The data driving chip 210 may include a data driving chip body 215 and aplurality of first pads 212 disposed on a top surface of the datadriving chip body 215. In addition, the display panel driver 200 mayfurther include a first bonding wire 250 electrically connecting atleast one first pad 212 with at least one bonding pad 242 of theflexible substrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 244 of theflexible substrate 240.

The at least one bonding pad 242 of the flexible substrate 240 may beelectrically connected to one of the data lines DL, and the at least onebonding pad 244 of the flexible substrate 240 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

FIG. 5 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 5 may be substantially the same as that ofFIGS. 1 to 4, except for a shape of a second bonding wire and pads thatthe second bonding wire connects. Accordingly, a repetitive descriptionof elements already described may be omitted for brevity.

Referring to FIGS. 1, 2 and 5, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 220. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 242 and 244. The flexible substrate 240 mayelectrically connect the printed circuit board 230 and the display panel100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may be adhered to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215 and aplurality of first pads 212 and 214 disposed on a top surface of thedata driving chip body 215. In addition, the display panel driver 200may further include a first bonding wire 250 electrically connecting atleast one first pad 212 with at least one bonding pad 242 of theflexible substrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 262. The second bonding wire 262electrically connects at least one second pad 222 with at least onefirst pad 214, and electrically connects the at least one first pad 214with at least one bonding pad 244 of the flexible substrate 240.

For example, the at least one bonding pad 242 of the flexible substrate240 may be electrically connected to one of the data lines DL, and theat least one bonding pad 244 of the flexible substrate 240 may beelectrically connected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The second bonding wire 262 may electrically connect the at least onebonding pad 244 of the flexible substrate 240 with the at least onesecond pad 222 through the at least one first pad 214 on the top surfaceof the data driving chip body 215 to increase electrical reliability.

FIG. 6 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 6 may be substantially the same as that ofFIGS. 1 to 4, except for a first conductive adhesive layer and padsdisposed between a flexible substrate and a data driving chip.Accordingly, a repetitive description of elements already described maybe omitted for brevity.

Referring to FIGS. 1, 2 and 6, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 220. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 246 and 244. The flexible substrate 240 mayelectrically connect the printed circuit board 230 and the display panel100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may be adhered to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215 and aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215. In addition, the display panel driver 200 mayfurther include a first conductive adhesive layer 272 interposed betweenthe data driving chip 210 and the flexible substrate 240. The firstconductive adhesive layer 272 may electrically connect at least onethird pad 216 with at least one bonding pad 246 of the flexiblesubstrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 arranged along a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 244 of theflexible substrate 240.

For example, the at least one bonding pad 246 of the flexible substrate240 may be electrically connected to one of the data lines DL, and theat least one bonding pad 244 of the flexible substrate 240 may beelectrically connected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 may be electrically connected to the flexiblesubstrate 240 not through a bonding wire but through the firstconductive adhesive layer 272 such that a manufacturing process of thedisplay device is simplified.

FIG. 7 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 7 may be substantially the same as that ofFIG. 6, except for a shape of a second bonding wire and pads that thesecond bonding wire connects. Accordingly, a repetitive description ofelements already described may be omitted for brevity.

Referring to FIGS. 1, 2 and 7, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA. The peripheral region PA does notdisplay an image. The active region AA may be referred to as a displayregion.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 220. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 246 and 244. The flexible substrate 240 mayelectrically connect the printed circuit board 230 and the display panel100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may be adhered to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215, aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215 and a plurality of first pads 214 disposed on atop surface of the data driving chip body 215. In addition, the displaypanel driver 200 may further include a first conductive adhesive layer272 interposed between the data driving chip 210 and the flexiblesubstrate 240. The first conductive adhesive layer 272 may electricallyconnect at least one third pad 216 with at least one bonding pad 246 ofthe flexible substrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 262. The second bonding wire 262electrically connects at least one second pad 222 with at least onefirst pad 214, and the at least one first pad 214 with at least onebonding pad 244 of the flexible substrate 240.

For example, the at least one bonding pad 246 of the flexible substrate240 may be electrically connected to one of the data lines DL, and theat least one bonding pad 244 of the flexible substrate 240 may beelectrically connected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 may be electrically connected to the flexiblesubstrate 240 not through a bonding wire but through the firstconductive adhesive layer 272 such that a manufacturing process of thedisplay device is simplified.

In addition, the second bonding wire 262 may be electrically connectedto the at least one bonding pad 244 of the flexible substrate 240through the at least one first pad 214 to increase an electricalreliability of the display apparatus.

FIG. 8 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 8 may be substantially the same as that ofFIG. 7, except for a second conductive adhesive layer and pads disposedbetween a data driving chip and a gate driving chip. Accordingly, arepetitive description of elements already described may be omitted forbrevity.

Referring to FIGS. 1, 2 and 8, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 220. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 246. The flexible substrate 240 mayelectrically connect the printed circuit board 230 and the display panel100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may be adhered to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215, aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215 and a plurality of first pads 218 disposed on atop surface of the data driving chip body 215. In addition, the displaypanel driver 200 may further include a first conductive adhesive layer272 interposed between the data driving chip 210 and the flexiblesubstrate 240. The first conductive adhesive layer 272 may electricallyconnect at least one third pad 216 with at least one bonding pad 246 ofthe flexible substrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of fourth pads 224 disposed on a bottom surface of the gatedriving chip body 225. The display panel driver 200 may further includea second conductive adhesive layer 282 interposed between the gatedriving chip 220 and the data driving chip 210. The second conductiveadhesive layer 282 may electrically connect at least one fourth pad 224with at least one first pad 218.

For example, the at least one bonding pad 246 of the flexible substrate240 may be electrically connected to one of the data lines DL or one ofthe gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 and gate driving chip 220 may be electricallyconnected to the flexible substrate 240 not through a bonding wire butthrough the first conductive adhesive layer 272 and the secondconductive adhesive layer 282 such that a manufacturing process of thedisplay device is simplified.

FIG. 9 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 9 may be substantially the same as that ofFIG. 6, except for a planar size of a gate driving chip. Accordingly, arepetitive description of elements already described may be omitted forbrevity.

Referring to FIGS. 1, 2 and 9, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA. The peripheral region PA does notdisplay an image. The active region AA may be referred to as a displayregion.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210 and agate driving chip 226. The display panel driver 200 may further includea printed circuit board 230 and a flexible substrate 240 having aplurality of bonding pads 246 and 244. The flexible substrate 240 mayelectrically connect the printed circuit board 230 and the display panel100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may be adhered to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215 and aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215. In addition, the display panel driver 200 mayfurther include a first conductive adhesive layer 272 interposed betweenthe data driving chip 210 and the flexible substrate 240. The firstconductive adhesive layer 272 may electrically connect at least onethird pad 216 with at least one bonding pad 246 of the flexiblesubstrate 240.

The gate driving chip 226 may be stacked on the data driving chip 210.For example, the gate driving chip 226 may adhere to the top surface ofthe data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 226 and the data driving chip 210.

The gate driving chip 226 may include a gate driving chip body 225 and aplurality of second pads 222 arranged along a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 244 of theflexible substrate 240.

In an exemplary embodiment of the present invention, a size of the gatedriving chip 220 may be substantially the same as a size of the datadriving chip 210 in plan view. For example, the gate driving chip 220may have the same size as the data driving chip 210 in a plan view, orthe gate driving chip 220 may be smaller than the data driving chip 210in a plan view.

For example, the at least one bonding pad 246 of the flexible substrate240 may be electrically connected to one of the data lines DL, and theat least one bonding pad 244 of the flexible substrate 240 may beelectrically connected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

In particular, the data driving chip 210 may be electrically connectedto the flexible substrate 240 not through a bonding wire but through thefirst conductive adhesive layer 272 such that a manufacturing processbecomes easy.

In addition, the size of the gate driving chip 226 and the size of thedata driving chip 210 may be substantially the same as each other suchthat it is easy to align the gate driving chip 226 and the data drivingchip 210 for stacking the gate driving chip 226 on the data driving chip210.

FIG. 10 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 10 may be substantially the same as that ofFIGS. 1 to 4, except for a sealing member that seals a data driving chipand a gate driving chip disposed on a flexible substrate. Accordingly, arepetitive description of elements already described may be omitted forbrevity.

Referring to FIGS. 1, 2 and 10, a display apparatus includes a displaypanel 100 and display panel driver 200.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110.

The display panel driver 200 may include a data driving chip 210, a gatedriving chip 220 and a sealing member 290 covering the data driving chip210 and the gate driving chip 220. The display panel driver 200 mayfurther include a printed circuit board 230 and a flexible substrate 240having a plurality of bonding pads 242 and 244. The flexible substrate240 may electrically connect the printed circuit board 230 and thedisplay panel 100.

The data driving chip 210 may be mounted on the flexible substrate 240as a COF. For example, the data driving chip 210 may adhere to theflexible substrate 240 by an adhesive layer 270 interposed between thedata driving chip 210 and the flexible substrate 240.

The data driving chip 210 may include a data driving chip body 215 and aplurality of first pads 212 disposed on a top surface of the datadriving chip body 215. In addition, the display panel driver 200 mayfurther include a first bonding wire 250 electrically connecting atleast one first pad 212 with at least one bonding pad 242 of theflexible substrate 240.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 arranged along a top surface of the gatedriving chip body 225. In addition, the display panel driver 200 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 244 of theflexible substrate 240.

The sealing member 290 may be provided on the flexible substrate 240 tocover the data driving chip 210 and the gate driving chip 220. Thesealing member 290 may protect the data driving chip 210 and the gatedriving chip 220. The sealing member 290 may include an epoxy compound.

For example, the at least one bonding pad 242 of the flexible substrate240 may be electrically connected to one of the data lines DL, and theat least one bonding pad 244 of the flexible substrate 240 may beelectrically connected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The sealing member 290 may protect the first bonding wire 250 and thesecond bonding wire 260 to increase an electrical reliability of thefirst and second bonding wires 250 and 260.

FIG. 11 is a plan view illustrating a display apparatus, according to anexemplary embodiment of the present invention. FIG. 12 is a perspectiveview illustrating the display apparatus of FIG. 11, according to anexemplary embodiment of the present invention. FIG. 13 is across-sectional view taken along line II-II′ of FIG. 11, according to anexemplary embodiment of the present invention. The display apparatus ofFIGS. 11 to 13 may be substantially the same as that of FIGS. 1 to 4,except for stacking a gate driving chip and a data driving chip on afirst substrate. Accordingly, a repetitive description of elementsalready described may be omitted for brevity.

Referring to FIGS. 11 to 13, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 112 and 114 disposed in theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 220. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230 andthe display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as achip on glass COG. For example, the data driving chip 210 may be adheredto the first substrate 110 by an adhesive layer 270 interposed betweenthe data driving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215 and aplurality of first pads 212 disposed on a top surface of the datadriving chip body 215. In addition, the display panel driver 202 mayfurther include a first bonding wire 250 electrically connecting atleast one first pad 212 with at least one bonding pad 112 of the firstsubstrate 110.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 arranged along a top surface of the gatedriving chip body 225. In addition, the display panel driver 202 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 114 of the firstsubstrate 110.

For example, the at least one bonding pad 112 of the first substrate 110may be electrically connected to one of the data lines DL, and the atleast one bonding pad 114 of the first substrate 110 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

FIG. 14 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 14 may be substantially the same as that ofFIG. 5, except for stacking a gate driving chip and a data driving chipon a first substrate. In addition, the display panel driver of FIG. 14may be substantially the same as that of FIG. 13, except for a shape ofa second bonding wire. Accordingly, a repetitive description of elementsalready described may be omitted for brevity.

Referring to FIGS. 11, 12 and 14, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 112 and 114 disposed in theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 220. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230 andthe display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as aCOG. For example, the data driving chip 210 may be adhered to the firstsubstrate 110 by an adhesive layer 270 interposed between the datadriving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215 and aplurality of first pads 212 and 214 disposed on a top surface of thedata driving chip body 215. In addition, the display panel driver 202may further include a first bonding wire 250 electrically connecting atleast one first pad 212 with at least one bonding pad 112 of the firstsubstrate 110.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 202 mayfurther include a second bonding wire 262. The second bonding wire 262electrically connects at least one second pad 222 with at least onefirst pad 214, and electrically connects the at least one first pad 214with at least one bonding pad 114 of the first substrate 110.

For example, the at least one bonding pad 112 of the first substrate 110may be electrically connected to one of the data lines DL, and the atleast one bonding pad 114 of the first substrate 110 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The second bonding wire 262 may electrically connect the at least onebonding pad 114 of the first substrate 110 with the at least one secondpad 222 through the at least one first pad 214 on the top surface of thedata driving chip body 215 to increase electrical reliability.

FIG. 15 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 15 may be substantially the same as that ofFIG. 6, except for stacking a gate driving chip and a data driving chipon a first substrate. Accordingly, a repetitive description of elementsalready described may be omitted for brevity.

Referring to FIGS. 11, 12 and 15, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 116 and 114 disposed on theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 220. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230with the display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as aCOG. For example, the data driving chip 210 may be adhered to the firstsubstrate 110 by an adhesive layer 270 interposed between the datadriving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215 and aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215. In addition, the display panel driver 202 mayfurther include a first conductive adhesive layer 272 interposed betweenthe data driving chip 210 and the first substrate 110. The firstconductive adhesive layer 272 may electrically connect at least onethird pad 216 with at least one bonding pad 116 of the first substrate110.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 arranged along a top surface of the gatedriving chip body 225. In addition, the display panel driver 202 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 114 of the firstsubstrate 110.

For example, the at least one bonding pad 116 of the first substrate 110may be electrically connected to one of the data lines DL, and the atleast one bonding pad 114 of the first substrate 110 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 may be electrically connected to the firstsubstrate 110 not through a bonding wire but through the firstconductive adhesive layer 272 such that a manufacturing process of thedisplay device is simplified.

FIG. 16 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 16 may be substantially the same as that ofFIG. 7, except for stacking a gate driving chip and a data driving chipon a first substrate. Accordingly, a repetitive description of elementsalready described may be omitted for brevity.

Referring to FIGS. 11, 12 and 16, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 116 and 114 disposed on theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 220. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230 andthe display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as aCOG. For example, the data driving chip 210 may be adhered to the firstsubstrate 110 by an adhesive layer 270 interposed between the datadriving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215, aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215 and a plurality of first pads 214 disposed on atop surface of the data driving chip body 215. In addition, the displaypanel driver 202 may further include a first conductive adhesive layer272 interposed between the data driving chip 210 and the first substrate110. The first conductive adhesive layer 272 may electrically connect atleast one third pad 216 with at least one bonding pad 116 of the firstsubstrate 110.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 202 mayfurther include a second bonding wire 262. The second bonding wire 262electrically connects at least one second pad 222 with at least onefirst pad 214, and electrically connects the at least one first pad 214with at least one bonding pad 114 of the first substrate 110.

For example, the at least one bonding pad 116 of the first substrate 110may be electrically connected to one of the data lines DL, and the atleast one bonding pad 114 of the first substrate 110 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 may be electrically connected to the firstsubstrate 110 not through a bonding wire but through the firstconductive adhesive layer 272 such that a manufacturing process of thedisplay device is simplified.

In addition, the second bonding wire 262 may be electrically connectedto the at least one bonding pad 114 of the first substrate 110 throughthe at least one first pad 214 to increase an electrical reliability ofthe display apparatus.

FIG. 17 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 17 may be substantially the same as that ofFIG. 8, except for stacking a gate driving chip and a data driving chipon a first substrate. Accordingly, a repetitive description of elementsalready described may be omitted for brevity.

Referring to FIGS. 11, 12 and 17, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 116 disposed on theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 220. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230with the display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as aCOG. For example, the data driving chip 210 may be adhered to the firstsubstrate 110 by an adhesive layer 270 interposed between the datadriving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215, aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215 and a plurality of first pads 218 disposed on atop surface of the data driving chip body 215. In addition, the displaypanel driver 202 may further include a first conductive adhesive layer272 interposed between the data driving chip 210 and the first substrate110. The first conductive adhesive layer 272 may electrically connect atleast one third pad 216 with at least one bonding pad 116 of the firstsubstrate 110.

The gate driving chip 220 may be stacked on the data driving chip 210.For example, the gate driving chip 220 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 220 and the data driving chip 210.

The gate driving chip 220 may include a gate driving chip body 225 and aplurality of fourth pads 224 disposed on a bottom surface of the gatedriving chip body 225. The display panel driver 202 may further includea second conductive adhesive layer 282 interposed between the gatedriving chip 220 and the data driving chip 210. The second conductiveadhesive layer 282 may electrically connect at least one fourth pad 224with at least one first pad 218.

For example, the at least one bonding pad 116 of the first substrate 110may be electrically connected to one of the data lines DL or one of thegate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 220 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 220 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 220 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 and gate driving chip 220 may be electricallyconnected to the first substrate 110 not through a bonding wire butthrough the first conductive adhesive layer 272 and the secondconductive adhesive layer 282 such that a manufacturing process of thedisplay device is simplified.

FIG. 18 is a cross-sectional view illustrating a display panel driver,according to an exemplary embodiment of the present invention. Thedisplay panel driver of FIG. 18 may be substantially the same as that ofFIG. 9, except for stacking a gate driving chip and a data driving chipon a first substrate. Thus like reference numerals refer to likeelements, and repetitive explanations thereon may be omitted herein.

Referring to FIGS. 11, 12 and 18, a display apparatus includes a displaypanel 100 and display panel driver 202.

The display panel 100 includes an active region AA on which an image isdisplayed and a peripheral region PA adjacent to the active region AA.The peripheral region PA does not display an image. The active region AAmay be referred to as a display region.

The display panel 100 includes a plurality of gate lines GL, each ofwhich extends in a first direction D1, and a plurality of data lines DL,each of which extends in a second direction D2 crossing the firstdirection D1. The display panel 100 includes a plurality of pixels. Thepixels are electrically connected to the gate lines GL and the datalines DL. The gate lines GL, the data lines DL and the pixels aredisposed in the active region AA of the display panel 100.

Each pixel includes a switching element TR, a liquid crystal capacitorand a storage capacitor. The liquid crystal capacitor and the storagecapacitor are electrically connected to the switching element TR. Thepixels may be disposed in a matrix form.

The display panel 100 may include a first substrate 110 and a secondsubstrate 120 opposite to the first substrate 110. The first substrate110 may include a plurality of bonding pads 116 and 114 disposed in theperipheral region PA.

The display panel driver 202 may include a data driving chip 210 and agate driving chip 226. The display panel driver 202 may further includea printed circuit board 230 and a flexible substrate 240. The flexiblesubstrate 240 may electrically connect the printed circuit board 230 andthe display panel 100.

The data driving chip 210 may be mounted on the first substrate 110 as aCOG. For example, the data driving chip 210 may be adhered to the firstsubstrate 110 by an adhesive layer 270 interposed between the datadriving chip 210 and the first substrate 110.

The data driving chip 210 may include a data driving chip body 215 and aplurality of third pads 216 disposed on a bottom surface of the datadriving chip body 215. In addition, the display panel driver 202 mayfurther include a first conductive adhesive layer 272 interposed betweenthe data driving chip 210 and the first substrate 110. The firstconductive adhesive layer 272 may electrically connect at least onethird pad 216 with at least one bonding pad 116 of the first substrate110.

The gate driving chip 226 may be stacked on the data driving chip 210.For example, the gate driving chip 226 may be adhered to the top surfaceof the data driving chip body 215 by an adhesive layer 280 interposedbetween the gate driving chip 226 and the data driving chip 210.

The gate driving chip 226 may include a gate driving chip body 225 and aplurality of second pads 222 disposed on a top surface of the gatedriving chip body 225. In addition, the display panel driver 202 mayfurther include a second bonding wire 260 electrically connecting atleast one second pad 222 with at least one bonding pad 114 of the firstsubstrate 110.

In an exemplary embodiment of the present invention, a size of the gatedriving chip 226 may be substantially the same as a size of the datadriving chip 210 in plan view.

For example, the at least one bonding pad 116 of the first substrate 110may be electrically connected to one of the data lines DL, and the atleast one bonding pad 114 of the first substrate 110 may be electricallyconnected to one of the gate lines GL.

According to an exemplary embodiment of the present invention, the gatedriving chip 226 may be stacked on the data driving chip 210.Accordingly, the gate driving chip 226 does not need to be disposed on ashort side of the display panel 100. Thus, a size of a bezel of thedisplay apparatus is decreased. In addition, by stacking the gatedriving chip 226 on the data driving chip 210, production costs andmanufacturing time of a display apparatus decreases.

The data driving chip 210 may be electrically connected to the firstsubstrate 110 not through a bonding wire but through the firstconductive adhesive layer 272 such that a manufacturing process becomeseasy.

In addition, the size of the gate driving chip 226 and the size of thedata driving chip 210 may be substantially the same as each other forconvenience of aligning the gate driving chip 226 on the data drivingchip 210.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be apparent tothose of ordinary skill in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the inventive concept as defined by the following claims.

What is claimed is:
 1. A display apparatus comprising: a display panelincluding a first substrate and a second substrate facing the firstsubstrate, wherein the first substrate includes a switching element, adata line and a gate line, wherein the data line and the gate line areelectrically connected to the switching element; and a display paneldriver including a data driving chip and a gate driving chip, whereinthe data driving chip and the gate driving chip are both disposed on asame side of the display panel, wherein the data driving chip applies adata signal to the data line and the gate driving chip applies a gatesignal to the gate line, wherein the gate driving chip is disposed on asurface of the data driving chip.
 2. The display apparatus of claim 1,wherein the display panel driver further comprises: a printed circuitboard including a driving circuit; and a flexible substrate including aplurality of bonding pads, wherein the flexible substrate electricallyconnects the printed circuit board with the display panel, wherein thedata driving chip is disposed on the flexible substrate.
 3. The displayapparatus of claim 2, wherein the data driving chip comprises: a datadriving chip body; and a first pad disposed on a top surface of the datadriving chip body, wherein the display panel driver further includes afirst bonding wire electrically connecting the first pad with a firstbonding pad of the plurality of bonding pads of the flexible substrate.4. The display apparatus of claim 3, wherein the gate driving chipcomprises: a gate driving chip body; and a second pad disposed on a topsurface of the gate driving chip body, wherein the display panel driverfurther includes a second bonding wire electrically connecting thesecond pad with a second bonding pad of the plurality of bonding pads ofthe flexible substrate.
 5. The display apparatus of claim 4, wherein thedata driving chip further comprises a third pad disposed on the topsurface of the data driving chip body, wherein the second bonding wireelectrically connects the second pad and the third pad with the secondbonding pad of the plurality of bonding pads of the flexible substrate.6. The display apparatus of claim 2, wherein the data driving chipcomprises: a data driving chip body; and a third pad disposed on abottom surface of the data driving chip body, wherein the display paneldriver further includes a first conductive adhesive layer disposedbetween the data driving chip and the flexible substrate, and whereinthe first conductive adhesive layer electrically connects the third padwith a first bonding pad of the plurality of bonding pads of theflexible substrate.
 7. The display apparatus of claim 6, wherein thegate driving chip comprises a gate driving chip body; and a second paddisposed on a top surface of the gate driving chip body, wherein thedisplay panel driver further includes a second bonding wire electricallyconnecting the second pad with a second bonding pad of the plurality ofbonding pads of the flexible substrate.
 8. The display apparatus ofclaim 7, wherein the data driving chip further includes a first paddisposed on a top surface of the data driving chip body, and wherein thesecond bonding wire electrically connects the first pad and the secondpad with the second bonding pad of the plurality of bonding pads of theflexible substrate.
 9. The display apparatus of claim 6, wherein thegate driving chip comprises: a gate driving chip body; and a fourth paddisposed on a bottom surface of the gate driving chip body, wherein thedata driving chip further includes a first pad disposed on a top surfaceof the data driving chip body, wherein the display panel driver furtherincludes a second conductive adhesive layer disposed between the gatedriving chip and the data driving chip, and wherein the secondconductive adhesive layer electrically connects the fourth pad with thefirst pad.
 10. The display apparatus of claim 1, wherein the datadriving chip is disposed on the first substrate, wherein the firstsubstrate includes a plurality of bonding pads, wherein the data drivingchip is electrically connected to the first substrate through theplurality of bonding pads.
 11. The display apparatus of claim 10,wherein the data driving chip further comprises: a data driving chipbody; and a first pad disposed on a top surface of the data driving chipbody, wherein the display panel driver further includes a first bondingwire electrically connecting the first pad with a first bonding pad ofthe plurality of bonding pads of the first substrate.
 12. The displayapparatus of claim 11, wherein the gate driving chip further comprises:a gate driving chip body; and a second pad disposed on a top surface ofthe gate driving chip body, wherein the display panel driver furtherincludes a second bonding wire electrically connecting the second padwith a second bonding pad of the plurality of bonding pads of the firstsubstrate.
 13. The display apparatus of claim 12, wherein the datadriving chip further comprises a third pad disposed on the top surfaceof the data driving chip body, wherein the second bonding wireelectrically connects the second pad and the third pad with the secondbonding pad of the plurality of bonding pads of the first substrate. 14.The display apparatus of claim 10, wherein the data driving chipcomprises: a data driving chip body; and a third pad disposed on abottom surface of the data driving chip body, wherein the display paneldriver further includes a first conductive adhesive layer disposedbetween the data driving chip and the first substrate, and wherein thefirst conductive adhesive layer electrically connects the third pad witha first bonding pad of the plurality of bonding pads of the firstsubstrate.
 15. The display apparatus of claim 14, wherein the gatedriving chip comprises: a gate driving chip body; and a second paddisposed on a top surface of the gate driving chip body, wherein thedisplay panel driver further includes a second bonding wire electricallyconnecting the second pad with a second bonding pad of the plurality ofbonding pads of the first substrate.
 16. The display apparatus of claim15, wherein the data driving chip further includes a first pad disposedon a top surface of the data driving chip body, and wherein the secondbonding wire electrically connects the first pad and the second pad withthe second bonding pad of the plurality of bonding pads of the firstsubstrate.
 17. The display apparatus of claim 14, wherein the gatedriving chip comprises: a gate driving chip body; and a fourth paddisposed on a bottom surface of the gate driving chip body, wherein thedata driving chip further includes a first pad disposed on a top surfaceof the data driving chip body, wherein the display panel driver furtherincludes a second conductive adhesive layer disposed between the gatedriving chip and the data driving chip, and wherein the secondconductive adhesive layer electrically connects the fourth pad with thefirst pad.
 18. The display apparatus of claim 1, wherein a size of thegate driving chip is substantially the same as a size of the datadriving chip in plan view.
 19. The display apparatus of claim 1, whereina size of the gate driving chip is less than a size of the data drivingchip in plan view.
 20. The display apparatus of claim 1, wherein thedisplay panel driver further includes a sealing member covering the datadriving chip and the gate driving chip.
 21. The display apparatus ofclaim 1, wherein the display panel further comprises: a flexiblesubstrate including a plurality of bonding pads arranged in a row,Wherein odd numbered bonding pads are connected to pads of the gatedriving chip and even numbered bonding pads are connected to pads of thedata driving chip, wherein the odd numbered bonding pads are connectedto a plurality of the gate lines and the even numbered bonding pads areconnected to a plurality of the data lines.
 22. The display apparatus ofclaim 1, wherein the display panel driver is connected to a plurality ofpads of the display panel by a plurality of bonding wires disposed in afan shape, wherein each of the plurality of bonding wires extendsdiagonally from a side of the display panel driver nearest to thedisplay panel, wherein the plurality of bonding wires further includesodd numbered bonding wires connected to pads of the gate driving chipand even numbered bonding wires connected to pads of the data drivingchip, and wherein the plurality of pads are disposed in a straight lineparallel to a first gate line.